Saru Alloys specialize in following Thermal Materials:

(i) Indium Alloys for Non-Metallic Bonding

SARU offers a wide variety of indium alloy for a various applications. These are available in paste, preform, ribbon, sphere, ingot, wire and foil form.

(ii) Indium Alloys for Ceramic Component to metal joining.

(IV) Thermal Interfaces:

Saru Alloys manufacturing free flouring, non-agglomerated Indium powder for thermal  interface paste materials.

Standard Indium Powder is –100 mesh,

·        Thermal Interface Material (TIM)

·         Soft Metal Alloy (SMA TIM)

·         Solder Thermal Material (sTIM)

·         Low Melt Alloy (LMA TIM) 

Thermal Interface Material (TIM)

High Performance thermal interface material is needed because even the largest heatsink and fan cannot effectively cool a processor unless there is good physical contact  between the base of the heatsink and the top of the processor. The surfaces of both the heatsink and the processor are not absolutely smooth. This surface roughness can be observed when examined at a microscopic level. Because this surface roughness reduces the effective contact area, attaching a heatsink   without a thermal interface material is not sufficient due to inadequate surface contact.

Five factors affect the choice, use, and performance of the interface material used between the processor and the heatsink. 

·         Thermal conductivity of the material

·         Electrical conductivity of the material

·         Spreading characteristics of the material

·         Long-term stability and reliability of the

·         Ease of application

Thermal Pads (Phase-Change Materials)

The key feature of thermal pads is their ability to change their physical characteristics. At room     temperature these materials are firm and easy to handle. This allows more control when applying the solid pads to a heatsink surface. The thermal material softens as it reaches component-operating temperatures. With the heat from the operating processor and a light clamping pressure, the phase-change material readily conforms to both surfaces. This ability to completely fill the interfacial air gaps and surface voids that are typical between component packages and heatsinks allows performance comparable to thermal grease.

Saru Alloys offers Thermal Interface Material (based on metallic alloys & solder) used for establishing an effected thermal path between heat generating component and heat sink attached to it.

The Thermal Interface Material -Thermal pads significantly aids the transfer of heat from the processor to the heatsink.

Saru Alloys offers TIM as thermal pads, also called phase-change materials and does not offer Thermal grease or Thermal paste, Thermal gel or other phase change materials ( not based on metallic alloy or solder).